2023 Form 5500 filing — Hosokawa Micron International, Inc. Group Insurance Plan
Plain-English filing summary
According to public Form 5500 filings published through the U.S. Department of Labor (DOL) Employee Benefits Security Administration (EBSA) via the EFAST2 system, this is the 2023 Form 5500 filing (EFAST2 acknowledgement 20240925121618NAL0014309057001) for Hosokawa Micron International, Inc. Group Insurance Plan, reported by Hosokawa Micron International, Inc. under EIN 13-3366823 and plan number 501. It reports 101 participants. Attached schedule details are not reported in the loaded dataset.
Filing snapshot
- EFAST2 acknowledgement
- 20240925121618NAL0014309057001
- Plan sponsor
- Hosokawa Micron International, Inc.
- EIN
- 13-3366823
- Plan number
- 501
- Location
- Summit, NJ
- Received date
- not reported in the loaded dataset
Reported financial snapshot
Reported figures as filed, in whole dollars. Only fields the filing reports are shown.
This 2023 filing is loaded, but detailed Schedule H/I financial figures are not present for it in the current loaded dataset. Participant counts and filing identity above are reported; asset and contribution detail comes from the financial schedules where filed.